Siemens Simcenter Flotherm XT 2304.0 (23.13.2) Win x64

Model the complexity
Realize localized PCB thermal modeling fidelity - Standalone Thermal Territories
Previously, Simcenter Flotherm XT established the value of component localized options for thermal modeling fidelity to provide the advantage of accuracy for modeling copper and layers beneath critical components. This computational efficiency solution remains a good alternative to explicitly modeling a whole board. In PCBs with many components positioned in close proximity or with overlapping thermal influence, there are workflow efficiency and modeling advantages to selecting an area for higher fidelity modeling instead of managing multiple component localized territories


In Simcenter Flotherm XT 2304, you can now designate a thermal territory independent of a specific component and draw it freely with any aspect ratio on a PCB. This allows you to configure your model and select appropriate accuracy more quickly.
Now with Simcenter Flotherm XT's thermal territories, you can now select to assign a thermal territory to a component or set a thermal territory based on a board location, while assigning an aspect ratio. You can effectively assign enhanced PCB localized thermal modeling anywhere on the board. The table below recaps the thermal territory options you can select based on the fidelity you are pursuing and your design stage information availability.




Navigate multi-layer PCB models easily - New Stackup Editor
It can be time consuming to edit layer properties for multi-layer complex PCBs. A new Board Layer Stackup Editor comes with improves workflow with easier multi-select and edit functionality and updated user experience. The short video below illustrates improvements.
Go faster & explore the possibilities
Smart PCB and electrothermal co-simulation updates
When modeling a entire PCB as a network assembly using the Smart PCB in Simcenter Flotherm XT 2304 for computationally efficient solution purposes, you can now gain further insight on joule heating calculations during the solve. You can turn on node calculation updates and show net outlines to speed up the process of setting up the Smart PCB.


During Hyperlynx PI co-simulation for PCB electrothermal modeling, added functionality now supports automatically detecting powered nets and automatic creation of a joule heat global goal. (For an introduction to electrothermal co-simulation, please see this video)
Parametric studies with Smart PCB
The thermal attribute attachment on a network assembly can now be varied in parametric study. The thermal attribute is entered as an input variable for network assembly nodes and different attributes applied for different scenarios.


Stay Integrated
Model Interoperability - XTXML export now supports SmartParts
To aid integration and data interchange with other Siemens tools and even within the Simcenter Flotherm family of tools, there are new updates for export of model assemblies leveraging XTXML format export. The XTXML schema has been updated to support SmartParts. One example usage is in exporting geometry to Simcenter Flotherm via the MCAD Bridge Module (see video above). One particular useful application is for exporting clean CAD based package geometry created in Simcenter Flotherm Package Creator for Simcenter Flotherm XT for subsequent use in Simcenter Flotherm 2304.





Simcenter Flotherm XT, CAD centric electronics cooling simulation software, connects MCAD and ECAD workflows to significantly shorten the thermal design process. Built on DNA of Simcenter Flotherm, mechanical engineers and thermal specialists can easily handle and modify native CAD geometry for accurate CFD studies in an intuitive interface designed for electronics thermal analysis. A robust EDA data import process is coupled with modeling fidelity options for PCB thermal modeling including copper trace joule heating. Engineers designing electronics thermal management solutions featuring heatsinks, fans, TECs, or liquid cooling can eliminate typical overheads in model creation and utilize parametric studies to optimize designs faster.
Hands on Simulate with Simcenter Flotherm XT - Fundamentals of electronics cooling (Session 1-3)
Electronics have increased the complexity of products. Simultaneously, the time and budget allocated to product design is shrinking, even as competition increases. Miniaturization is forcing the mechanical and electronic design flows to converge, leading to increased power densities. This makes it harder than ever to efficiently remove heat, leading to performance and reliability problems. More importantly, there are safety concerns.
Frontloading simulation - using simulation early in the design process - helps companies develop products that are light, thin, silent and lower in cost. This can be accomplished using Simcenter Flotherm XT, a unique, award-winning thermal simulation solution that can be used during all stages of the electronics design process, from conceptual design to manufacturing, to improve product quality, reliability and time to market.
Mentor Graphics,a Siemens Business, is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world's most successful electronic, semiconductor and systems companies. We enable companies to develop better electronic products faster and more cost-effectively. Our innovative products help conquer complex design challenges. Mentor is technology leader in full chip emulation, Functional Verification, Design-for-Test and physical verification with its Veloce, Questa, Tessent and Calibre platforms.